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NTMFS4122N
Power MOSFET
30 V, 23 A, Single N ? Channel,
SO ? 8 Flat Lead
Features
? Low R DS(on)
? Low Inductance SO ? 8 Package
? These are Pb ? Free Devices
Applications
? Notebooks, Graphics Cards
? DC ? DC Converters
? Synchronous Rectification
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) TYP
4.6 m W @ 10 V
6.3 m W @ 4.5 V
D
I D MAX
(Note 1)
23 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
V GS
$ 20
V
G
Continuous Drain Current
(Note 1 )
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
14
10
A
S
T A = 25 ° C
T A = 85 ° C
Power Dissipation (Note 1)
Continuous Drain Current
(Note 2)
Power Dissipation (Note 2)
Pulsed Drain Current
t v 10 s T A = 25 ° C
Steady
State
t v 10 s
T A = 25 ° C
Steady
State
T A = 25 ° C
t p = 10 m s
P D
I D
P D
I DM
23
2.2
5.8
9.1
6.5
0.9
68
W
A
W
A
1
SO ? 8 FLAT LEAD
CASE 488AA
STYLE 1
S
S
S
G
MARKING
DIAGRAM
D
4122N
AYWZZ
D
D
D
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 30 V, V GS = 10 V, I PK = 21 A, L = 1 mH,
R G = 25 W )
T J , T stg
I S
E AS
? 55 to
150
7.0
220
° C
A
mJ
4122N
A
Y
W
ZZ
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
THERMAL RESISTANCE MAXIMUM RATINGS
T L
260
° C
ORDERING INFORMATION
Shipping ?
Device
Package
Parameter
Junction ? to ? Ambient ? Steady State (Note 1)
Junction ? to ? Ambient ? t v 10 s (Note 1)
Junction ? to ? Ambient ? Steady State (Note 2)
Symbol
R q JA
R q JA
R q JA
Value
56.3
21.5
141.6
Unit
° C/W
NTMFS4122NT1G
NTMFS4122NT3G
SO ? 8 FL
(Pb ? Free)
SO ? 8 FL
(Pb ? Free)
1500 Tape & Reel
5000 Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.0264 in sq).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 5
1
Publication Order Number:
NTMFS4122N/D
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